Xiaomi has launched its 3nm Xring O3 mobile processor with enhanced AI capabilities as it looks to gain greater control over chips used in flagship devices.
Waymo has revealed a custom 5nm ASIC for its robotaxis, designed to process camera, lidar and radar data in real time as it scales its sixth-generation autonomous driving system.
NVIDIA and TSMC unveil the first US-made Blackwell AI chip wafer, marking a major step toward strengthening domestic semiconductor manufacturing and AI infrastructure.
Nvidia has placed a 300,000-unit order for its H20 AI chips with TSMC to meet resurgent demand in China following eased U.S. export controls, which are tailored to comply with regulatory guidelines.
